STRUCTURE, ELECTRICAL RESISTIVITY AND THERMAL CONDUCTIVITY OF ALUMINUM NITRIDE MATRIX PHASE MATERIAL WITH ADITION OF TANTALUM CARBIDE AND TITANUM ALUMINIDE
Keywords:
aluminum nitride, tantalum carbide, titanium aluminide, microstructure, thermal conductivity, electrical resistivity
Abstract
The AlN–Y2O3–2.5%TaC–7.5%TiAl3 ceramic composite was prepared by pressureless sintering and its properties have been examined. Microstructural characteristics, measured values of thermal conductivity at room temperature and electrical resistivity in the 300-700 K temperature range are presented. As-prepared material is proposed for making parts of high-power density electronics operated at elevated temperatures.
Published
2025-11-21
Section
Development and implementation of equipment and tools equipped with hard alloys