FORMATION OF THE STRUCTURE OF HEAT-CONDUCTING DIAMOND POLYCRYSTALLINE COMPOSITE MATERIALS DURING SINTERING UNDER HPNT CONDITIONS OF DIAMOND POWDERS WITH UNCONVENTIONAL ACTIVATING ADDITIVES AND N-LAYER GRAPHENES

Abstract

A comprehensive study of the influence of unconventional additives activating the sintering process (Cu, Cu–Mo, Cu–W, Cu–Si) and n-layer graphenes during sintering under HPHT conditions of diamond powders of various genesis and fractional composition on the formation of the structure and properties of diamond polycrystalline composite materials has been carried out. (APKM). The important role of activating additives of molybdenum, tungsten, and silicon and their carbides in the formation of the thermal conductivity of copper – carbide – diamond interphase boundaries and the thermal conductivity of the diamond – copper composite as a whole has been shown experimentally. For the first time, a diamond composite with a thermal conductivity of at least 630 W/(m×K) was obtained by impregnation in HPHT conditions of diamond powder with a copper-silicon melt.