THERMAL CONDUCTIVITY AND ELECTRICAL RESISTANCE OF DIAMOND POLYCRYSTALS AND DIAMOND-COPPER, DIAMOND-COPPER-TITAN COMPOSITES

Abstract

The dependence of the electrical resistivity of diamond composites and polycrystals on the sintering duration and the influence of the bond on the thermal conductivity of diamond materials have been studied. The lowest value of the resistivity is in the diamond-copper composite, and above – in the diamond polycrystals, which do not contain additives. It is shown that as the duration of sintering increases, the electrical resistivity of the samples decreases, and the density increases. The thermal conductivity of polycrystals is realized mainly through the phonon component. The introduction of copper bond increases the thermal conductivity of composites, and the introduction of a copper-titanium bond reduces it